Molded Products×中谷産業 - List of Manufacturers, Suppliers, Companies and Products

Molded Products Product List

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"Hot melt molding" alternative to potting method and injection molding!

Molding at low temperature and low pressure allows for reduced damage to electronic components! Compared to conventional methods, productivity has significantly improved and contributes to cost reduction!

Our company conducts "hot melt molding," which injects low-melting-point thermoplastic resin into molds under low pressure to insert mold various electronic components, thereby adding diverse and excellent protective performance. Compared to conventional methods, this approach reduces damage to delicate electronic components while achieving increased productivity and lightweight, compact designs. Additionally, since the external shape can be directly molded, improvements in design aesthetics can also be expected. 【Features】 ■ Fast ■ Cost-effective ■ Considerate of both products and the environment *For more details, please download the PDF or feel free to contact us.

Company：中谷産業
Price：Other

Other electronic parts
Processing Contract
Surface treatment contract service

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Nakatani's Hot Melt Molding Product Edition

Reduce component damage! Supports complex shapes, insert parts, and flexible designs, including circuit boards!

Nakatani's "Hot Melt Molding" excels in functionality and design, accommodating complex shapes, insert parts, and flexible applications, including circuit boards. It supports transparency and visual inspection of internal components. It can achieve integrated molding with general molded products and external parts, maintaining the same appearance level as conventional molding. Additionally, the demand for it as an alternative to coatings is also expanding. 【Functional Features】 ■ Waterproof, adhesive strength, high temperature and humidity, low temperature, heat shock, cooling effect ■ Ensures adhesive strength and airtightness with wiring, enclosures, etc. ■ Temperature shock test: -20°C to 60°C for 400 cycles ■ Freezing test at -20°C ■ Bending and tensile tests *For more details, please refer to the PDF materials or feel free to contact us.

Company：中谷産業
Price：Other

Processing Contract
Surface treatment contract service

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Case study of lightweight hot melt molding

Lightweight design and increased design flexibility are possible! Recommended for automotive parts manufacturers and industrial equipment manufacturers.

We would like to introduce a case of partial sealing of electronic components conducted at a certain industrial equipment manufacturer. We achieved weight reduction and successfully reduced the amount of resin used. Furthermore, sealing is possible for a maximum size (actual value) of 300mm × 250mm. This is recommended for automotive accessory manufacturers and industrial equipment manufacturers where weight reduction and durability are required. 【Case Study】 - Achieved weight reduction - Successfully reduced resin usage - One-time molding *For more details, please refer to the PDF document or feel free to contact us.